Plasma cleaning system
Technical index:
Frequency: 2.456 GHz.
Gas: oxygen, argon.
Sample size: up to 4 inches.
Used for plasma surface modification, organic surface plasma cleaning, plasma etching applications, plasma ashing applications, enhancing or weakening wettability, etc.
Located: 205, Building M
Dry transfer system
Technical index:
Humidity: < 0.1 ppm.
Oxygen content: < 0.1 ppm.
It is used to make nano-devices by dry transfer stacking and other technologies under oxygen-free and moisture-free conditions.
Located: 203, Building M
Wire bonder
Technical index:
Aluminum wire or gold wire, wire diameter: 25μm.
Adhesion: 15 - 150 cN.
Pressure point size: 30 * 40 μm.
Wire bonding technology is an ultrasonic friction welding process that establishes electrical connections between the chip and the respective substrate surface. In our laboratory, it is mainly used to make leads for various nano devices.
Located: B121, Building M