Facilities

plasma cleaning

Plasma cleaning system

Technical index:
Frequency: 2.456 GHz.
Gas: oxygen, argon.
Sample size: up to 4 inches.
Used for plasma surface modification, organic surface plasma cleaning, plasma etching applications, plasma ashing applications, enhancing or weakening wettability, etc.

Located: 205, Building M

Dry transfer system

Dry transfer system

Technical index:
Humidity: < 0.1 ppm.
Oxygen content: < 0.1 ppm.
It is used to make nano-devices by dry transfer stacking and other technologies under oxygen-free and moisture-free conditions.

Located: 203, Building M

Wire bonder

Wire bonder

Technical index:
Aluminum wire or gold wire, wire diameter: 25μm.
Adhesion: 15 - 150 cN.
Pressure point size: 30 * 40 μm.
Wire bonding technology is an ultrasonic friction welding process that establishes electrical connections between the chip and the respective substrate surface. In our laboratory, it is mainly used to make leads for various nano devices.

Located: B121, Building M